Sapphire Crystal Wire Cutting Fluid is specially used as cooling and lubricating liquid in the process of sapphire crystal wire cutting. Sapphire is a material with extremely high hardness and is widely used in high-precision fields such as electronics, optics, aerospace, etc. Therefore, the requirements for equipment and cutting fluid during processing are very high.
Sapphire Rod Digging Coolant is a coolant specially used in metal processing and material cutting processes, mainly used in the processing of sapphire materials.
Silicon wafer cutting fluid DK-760M is suitable for various machining processes of semiconductor materials such as monocrystalline silicon, polycrystalline silicon, wafers, and ceramics, including milling, rolling, coarse grinding, fine grinding, edge grinding, and chamfering. It offers strong lubrication and cleaning penetration, effectively enhancing processing efficiency and being a reliable aid in your machining operations.
Silicon wafer wire cutting fluid DK-760D is used for diamond wire cutting of semiconductor materials like monocrystalline silicon, polycrystalline silicon, wafers, and ceramics. It is formulated with surfactants, lubricants, EP additives, and other auxiliaries, making it an environmentally friendly, fully synthetic wire cutting fluid.